We have received several questions regarding the best approach to cleaning solid samples and standards that have been prepared as chips for analysis by a total dissolution technique, such as ICP-OES or ICP-MS. Let’s first discuss common approaches for sampling, and then appropriate methodologies for ensuring chips are clean and free from contamination.
Metal alloys are commonly analyzed using solid sampling techniques such as Arc/spark optical emission spectroscopy (A/S OES), X-ray Fluorescence Spectroscopy (both Energy Dispersive (ED-XRF) and Wavelength Dispersive (WD-XRF)), and X-ray Diffraction (XRD). These techniques provide fast analysis with little or no sample preparation required, and can be provided as portable units, and in the case of XRF, hand-held units, for maximum flexibility. These techniques also are considered non-destructive in that the metal alloy is left largely unchanged after analysis, and is available for further testing or archiving.
The use of an Internal Standard (IS) can significantly improve both the accuracy and precision of your ICP-OES analytical results. This post addresses: how internal standards work, how to select an appropriate IS element, and how this methodology can be easily incorporated into your lab’s analytical procedures.
LGC ARMI is pleased to announce the release of two new standards, IARM 282A and IARM 4F.
These reference materials are available in three different forms depending on your analytical technique; 38mm diamater x 3mm thickness for XRF, 38mm diameter x 19mm thickness for arc spark OES or as chips for analysis by ICP or AA.