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1
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2
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- Typical alloy composition:
- Cu 75 - 85%
- Zn 0 8
- Sn 4 5
- Bi 0.5 5
- Pb 0.25 or lower Max
- Sb 0.25 or lower Max
- Se 0.01 0.2
- Trace elements
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3
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- Typical alloys
- C89833
- C89836
- C89510
- C89520
- Federalloys
- Magnolia
- Proprietary variants
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4
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- Slug samples
- Saw samples across any potential chill segregation
- Use sawings for Cu and ICP determination
- Use side of slug for Spark source e-spec
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5
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- Gravimetric Copper:
- Alloying constituents plate with Copper
- Chemical separation is time consuming and not practical in a production
environment
- Plating is incomplete
- Plating is porous
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6
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7
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8
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- For alloy containing:
- 85% Cu
- 2% Bi
- Cu retained in plating solution: 0.05 - 0.10 %
- Bi plated 1.80 - 1.85 %
- Look for any non-adherent particles, if present, filter, dissolve and
quantify via ICP
- Occasionally will be present, maximum observed 0.02 %
- Usually an indication that plating current needs to be reduced
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9
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- Bi via ICP:
- Matched standards are a necessity
- Complete dissolution is mandatory
- Use HCl + H2O2
- Use moderate heat to avoid volatilization of Sn, Sb, As
- Selection of wavelenght:
- 223.061 nm
- Selection of background points is critical
- Reagent blanking
- Adequate dilution
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10
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- Dissolution
- Hf is a necessity
- Moderate heat during dissolution
- Do not use commercial H2O2
- Assure adequate HCl to keep in solution
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11
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12
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- Al 396.152 nm
- B 249.773
- Be 313.107
- Bi 223.061
- Cu 224.700
- Fe 259.940
- Mn 260.569
- Ni 231.604
- Pb 220.353
- Sb 217.581
- Se 196.026
- Si 288.158
- Sn 189.926
- Zn 206.200
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