1	Latest Developments in Portable XRF Technology ILAP 2005 Jim Pasmore
2	Portable EDXRF Testing Applications
3	Handheld EDXRF Analyzer
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5	Software and Hardware Advancements Alloy Mode Averaging feature All modes Backwards & Forwards All Modes Hardware and software changes: New CPU board → Faster, more memory Features: More flexible customizations Bluetooth module – master / slave Windows-style GUI Improved Fundamental Parameters K, L, & M, plus 3 consecutive element solution
6	New “S” (SuperRes) Detector for Alloy 6 mm² Amptek Si-PIN Improved Resolution 188 eV resolution at Mn line Improved count throughput Larger area coupled with better electronics > higher count rates Well in excess of 20,000 cps
7	S Detector
8	S Detector Target Applications Difficult Alloy Separations Examples: CP Mo Vs TZM, Pure W Vs thoriated/lanthanated W Tramp Cu in Steel Cu can present severe mechanical deficiencies in steels Practical action level: 0.1% Cu Flow Accelerated Corrosion (FAC) prevention FAC of C steels appreciably slowed by presence of low levels of Cr Minimum Cr: 0.05% Chromate coatings Estimated LODs of < 100 angstroms Note: It is commonly accepted that most XRF instruments will not detect Cr in conversion coatings unless they are at least a few thousand angstroms in thickness
9	S Detector + Filters: LOD’s, Ferrous Base
10	Thin Window, Big Area Detector Primary target: Environmental and Mineral Exploration Big: 13 mm² crystal 1 mil thin Be window New welding technique Better resolution: New 13mm²: 210eV Current BASP: 260eV Light Element Capabilities: P, S, Cl, Ca, etc New Applications e.g. Forensics
11	Thin Window, Big Area Detector Spectral Overlay
12	High Temp Accessory Developments
13	New Test Stand
14	New Helium Purge Filter configuration Filter 1 (Al, Fe Mo) –35kV output Filter 2 (1 mil Kapton) –6kV output: (for regions 3kV and lower) Cl and lower E peaks (keV):` NOTE: Deconvolution: Sb(Ca), Sn(K), Ag(K), Bi(S), Mo(S), Pb(S), Nb(P), Zr(P) Subtracted: W, Ta, Hf
15	Helium Purge: Consumables
16	Helium Purge: Aluminum Alloys
17	Helium Purge: Aluminum Alloys
18	Helium Purge: Al in Ti Calibration Accuracy
19	Helium Purge: Al in Ni Spectra
20	Helium Purge: Al/Si Bronze Calibration Accuracy
21	RoHS and WEEE Applications RoHS European Parliament and Council Directive 2002/95/EC: Restriction of the use of certain Hazardous Substances in electrical and electronic equipment July 1^st, 2006 Maximum levels in consumer products Cadmium (Cd) 0.01% Mercury (Hg) 0.1% Lead (Pb) 0.1% Hexavalent chromium (Cr(VI)) 0.1% Polybrominated Biphenyls (PBB) 0.1% Polybrominated Diphenyls (PBDE) 0.1% WEEE European Parliament and Council Directive 2002/96/EC on Waste Electrical and Electronic Equipment () Responsible recycling of electronic equipment August 2005
22	Elements of Interest in RoHS/WEEE Application
23	Advantages of PXRF for RoHS Effective tool for RoHS/WEEE compliance Quantifies ppm levels: Pb, Hg, Cr, Cd, Br, Sb Applicable throughout supply chain Guided decision making Non-Compliant, Compliant, Inconclusive Rapid, high-throughput testing at point of manufacture In-situ, real-time results
24	Latest RoHS Hardware and Software Improved sensitivity for rapid in-situ testing Latest software handles wide range of sample types with minimum operator input PE, PVC, alloys, solders, packaging materials Latest software handles odd shapes/sizes of sample wires, cables, etc. Ideal application: Where high volume or rapid response is critical
25	New Matrix Evaluation Software Presence of Chlorine in PVCs modifies x-ray properties of material Plastics” calibration is different for either: PVC-based (PVC) Non PVC-based (ABS, PTFE, HDPE, LDPE, PET, PS) New PVC vs non-PVC auto-determination By voltage switching: 40kV (new capability) to 25 kV, and back to 40 in first few seconds
26	Latest Performance: Analysis of Solders
27	New Pass Fail Thresholds for RoHS An asterisk (e.g. Cd*) indicates element concentration minus uncertainty is higher than the Fail limit. A question mark (e.g. Cd?) means element concentration is inconclusive, i.e. in between Pass/Fail limits An element with neither asterisk or question mark (e.g. Cd) means concentration of element plus uncertainty is lower than Pass limit
28	Elements in Plastics, Latest LOD’s
29	Proposed RoHS Test Procedure
30	Many New NITON Support Documents AGEC-2005 Paper by Stan Piorek GPEC-2004 Paper by Stan Piorek White Paper by Stan Piorek RoHS/WEEE Overview by Jim Pasmore On-Site Elemental Screening of Plastics NITON Application Bulletin Saving the Risk of Tin Whiskers NITON Application Bulletin On-Site Lead Screening of Electronic Components NITON Application Bulletin XLt 794 Standard Operating Procedure NITON SOP XLt 797Z Standard Operating Procedure NITON SOP
31	Selected U.S. RoHS/WEEE Customers Benchmark Electronics APC (American Power Conversions) Tyco Electronics Coherent (laser component manufacturer) Vishay Electronics Brady Corp. (adding machines/portable printers/scanners) Bose (speakers/radios) Lifetime Hoan (Kitchen Aid) Note: Worldwide NITON has installed several hundred analyzers for the WEEE/RoHS application The preponderance are in China and Japan
32	R & D 100 Awards 1995: Niton wins R&D 100 AWARD for XL-309 Lead Analyzer 2003: Niton wins second R&D 100 AWARD for XLi Infiniton & XLt Analyzers
33	IDEA AWARDS Gold 2005
34	And now …. … A brief demonstration